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| Title: | An alternate theoretical approach to solid-state bonding |
| Authors: | Lagos, M.
Retamal, C. |
| Keywords: | Diffusion bonding
Superplasticity
Plasticity
Grain boundary sliding
Strain rate |
| Issue Date: | Mar-2011 |
| Publisher: | PERGAMON-ELSEVIER SCIENCE LTD |
| Citation: | SCRIPTA MATERIALIA Volume: 64 Issue: 5 Pages: 402-405 DOI: 10.1016/j.scriptamat.2010.10.044 |
| Abstract: | A novel physical explanation for solid-state bonding is presented, which yields closed-form equations relating the bonding progression with time, temperature, applied pressure and the constants characterizing the material. Excellent agreement with experiment is attained, with no adjustable parameter. In the novel scheme, diffusion bonding is caused by the interpenetration of the two surfaces at the grain level. The process is driven by the strong tensile stress field induced in the plane of the interface by the plastic deformation. (C) 2010 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved. |
| Description: | Lagos, M (reprint author), Univ Talca, Fac Ingn, Campus Los Niches, Curico, Chile. |
| URI: | http://dspace.utalca.cl/handle/1950/8905 |
| ISSN: | 1359-6462 |
| Appears in Collections: | Artículos en publicaciones ISI - Universidad de Talca
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